RPL-S i9-13900KS 24C(8P+16E)32T 3.2/2.4G 150W36M 770 1700 B0
Summary Description
Key Features
- Intel® Core™ i9 i9-13900KS
- 36 MB Smart Cache LGA 1700
- Processor cores: 24 64-bit
- Maximum internal memory supported by processor: 192 GB DDR4-SDRAM, DDR5-SDRAM
- On-board graphics card Intel UHD Graphics 770
Key Applications
- Gaming PCs
- Content Creation Workstations
- High-Performance Desktops
- AI Workloads
- Deep Learning
- Data Analysis
- Virtual Reality
- 3D Rendering
- Scientific Computing
- Software Development
Description
Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
Intel® Deep Learning Boost (Intel® DL Boost)
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.
Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.
Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Volume Management Device (VMD)
Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
Product Specifications
Specification | Details |
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Processor | |
Processor manufacturer |
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Processor generation |
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Processor model |
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Processor family |
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Processor cores |
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Processor socket |
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Processor threads |
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Processor operating modes |
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Performance cores |
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Efficient cores |
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Processor boost frequency |
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Performance-core boost frequency |
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Performance-core base frequency |
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Efficient-core boost frequency |
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Efficient-core base frequency |
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Processor cache |
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Processor cache type |
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Box |
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Processor base power |
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Maximum turbo power |
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Stepping |
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Bus type |
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Maximum number of DMI lanes |
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Memory bandwidth supported by processor (max) |
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Processor codename |
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Processor ARK ID |
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Memory | |
Maximum internal memory supported by processor |
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Memory types supported by processor |
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Memory channels |
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ECC |
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Memory bandwidth (max) |
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Graphics | |
On-board graphics card |
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Discrete graphics card |
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On-board graphics card model |
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On-board graphics card outputs supported |
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On-board graphics card base frequency |
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On-board graphics card dynamic frequency (max) |
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Number of displays supported (on-board graphics) |
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On-board graphics card DirectX version |
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On-board graphics card OpenGL version |
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On-board graphics card maximum resolution (DisplayPort) |
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On-board graphics card maximum resolution (eDP - Integrated Flat Panel) |
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On-board graphics card maximum resolution (HDMI) |
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On-board graphics card refresh rate at maximum resolution (DisplayPort) |
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On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) |
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On-board graphics card refresh rate at maximum resolution (HDMI) |
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On-board graphics card ID |
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Discrete graphics card model |
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Number of execution units |
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Multi-Format Codec Engines |
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Features | |
Execute Disable Bit |
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Idle States |
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Thermal Monitoring Technologies |
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Market segment |
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Use conditions |
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Maximum number of PCI Express lanes |
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PCI Express slots version |
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PCI Express configurations |
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Supported instruction sets |
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Scalability |
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CPU configuration (max) |
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Embedded options available |
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Direct Media Interface (DMI) Revision |
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Export Control Classification Number (ECCN) |
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Commodity Classification Automated Tracking System (CCATS) |
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Processor special features | |
Intel® Hyper Threading Technology (Intel® HT Technology) |
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Intel® Turbo Boost Technology |
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Intel® Quick Sync Video Technology |
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Intel® Clear Video HD Technology (Intel® CVT HD) |
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Intel® AES New Instructions (Intel® AES-NI) |
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Enhanced Intel SpeedStep Technology |
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Intel Trusted Execution Technology |
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Intel® Speed Shift Technology |
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Intel® Thermal Velocity Boost |
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Intel® Adaptive Boost Technology |
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Intel® Turbo Boost Max Technology 3.0 frequency |
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Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0 |
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Intel® Thermal Velocity Boost Frequency |
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Intel® Control-flow Enforcement Technology (CET) |
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Intel® Thread Director |
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Intel VT-x with Extended Page Tables (EPT) |
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Intel® Secure Key |
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Intel® Active Management Technology (Intel® AMT) |
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Intel Stable Image Platform Program (SIPP) |
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Intel® OS Guard |
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Intel 64 |
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Intel Virtualization Technology (VT-x) |
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Intel Virtualization Technology for Directed I/O (VT-d) |
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Intel Turbo Boost Max Technology 3.0 |
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Intel® Boot Guard |
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Intel® Deep Learning Boost (Intel® DL Boost) |
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Intel® Volume Management Device (VMD) |
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Mode-based Execute Control (MBE) |
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Intel® vPro™ Platform Eligibility |
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Intel® Standard Manageability (ISM) |
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Intel® One-Click Recovery |
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Intel® Stable IT Platform Program (SIPP) |
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Intel® Remote Platform Erase (RPE) |
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Intel® Virtualization Technology with Redirect Protection (VT-rp) |
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Intel vPro® Enterprise Platform Eligibility |
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Intel® Threat Detection Technology (TDT) |
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Intel® Hardware Shield Eligibility |
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Intel® Total Memory Encryption - Multi Key |
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Intel vPro® Essentials Platform Eligibility |
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Operational conditions | |
Tjunction |
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Technical details | |
Target market |
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OpenCL version |
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Launch date |
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Status |
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Logistics data | |
Harmonized System (HS) code |
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Packaging data | |
Package type |
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Other features | |
L2 cache |
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Maximum internal memory |
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Graphics output |
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