RPL-S i9-13900KS 24C(8P+16E)32T 3.2/2.4G 150W36M 770 1700 B0

CM8071504820503
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    Summary Description

    Intel Core i9-13900KS. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.8 GHz, Intel® Thermal Velocity Boost Frequency: 6 GHz

    Key Features

    • Intel® Core™ i9 i9-13900KS
    • 36 MB Smart Cache LGA 1700
    • Processor cores: 24 64-bit
    • Maximum internal memory supported by processor: 192 GB DDR4-SDRAM, DDR5-SDRAM
    • On-board graphics card Intel UHD Graphics 770

    Key Applications

    • Gaming PCs
    • Content Creation Workstations
    • High-Performance Desktops
    • AI Workloads
    • Deep Learning
    • Data Analysis
    • Virtual Reality
    • 3D Rendering
    • Scientific Computing
    • Software Development

    Description

    Intel® Gaussian & Neural Accelerator
    Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

    Intel® Deep Learning Boost (Intel® DL Boost)
    A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

    Intel® Speed Shift Technology
    Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

    Intel® Thermal Velocity Boost
    Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

    Intel® Turbo Boost Max Technology 3.0
    Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

    Intel® Turbo Boost Technology
    Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

    Intel® Hyper-Threading Technology
    Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

    Idle States
    Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

    Enhanced Intel SpeedStep® Technology
    Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

    Thermal Monitoring Technologies
    Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

    Intel® Volume Management Device (VMD)
    Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

    Product Specifications

    Specification Details
    Processor
    Processor manufacturer
    • Intel
    Processor generation
    • Intel Core i9-13xxx
    Processor model
    • i9-13900KS
    Processor family
    • Intel Core i9
    Processor cores
    • 24
    Processor socket
    • LGA 1700
    Processor threads
    • 32
    Processor operating modes
    • 64-bit
    Performance cores
    • 8
    Efficient cores
    • 16
    Processor boost frequency
    • 6
    Performance-core boost frequency
    • 5.4
    Performance-core base frequency
    • 3.2
    Efficient-core boost frequency
    • 4.3
    Efficient-core base frequency
    • 2.4
    Processor cache
    • 36
    Processor cache type
    • Smart Cache
    Box
    • No
    Processor base power
    • 150
    Maximum turbo power
    • 253
    Stepping
    • B0
    Bus type
    • DMI4
    Maximum number of DMI lanes
    • 8
    Memory bandwidth supported by processor (max)
    • 89.6
    Processor codename
    • Raptor Lake
    Processor ARK ID
    • 232167
    Memory
    Maximum internal memory supported by processor
    • 192
    Memory types supported by processor
    • DDR4-SDRAM,DDR5-SDRAM
    Memory channels
    • Dual-channel
    ECC
    • Yes
    Memory bandwidth (max)
    • 89.6
    Graphics
    On-board graphics card
    • Yes
    Discrete graphics card
    • No
    On-board graphics card model
    • Intel UHD Graphics 770
    On-board graphics card outputs supported
    • Embedded DisplayPort (eDP) 1.4b,DisplayPort 1.4a,HDMI 2.1
    On-board graphics card base frequency
    • 300
    On-board graphics card dynamic frequency (max)
    • 1650
    Number of displays supported (on-board graphics)
    • 4
    On-board graphics card DirectX version
    • 12.0
    On-board graphics card OpenGL version
    • 4.5
    On-board graphics card maximum resolution (DisplayPort)
    • 7680 x 4320
    On-board graphics card maximum resolution (eDP - Integrated Flat Panel)
    • 5120 x 3200
    On-board graphics card maximum resolution (HDMI)
    • 4096 x 2160
    On-board graphics card refresh rate at maximum resolution (DisplayPort)
    • 60
    On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)
    • 120
    On-board graphics card refresh rate at maximum resolution (HDMI)
    • 60
    On-board graphics card ID
    • 0xA780
    Discrete graphics card model
    • Not available
    Number of execution units
    • 32
    Multi-Format Codec Engines
    • 2
    Features
    Execute Disable Bit
    • Yes
    Idle States
    • Yes
    Thermal Monitoring Technologies
    • Yes
    Market segment
    • Desktop
    Use conditions
    • PC/Client/Tablet
    Maximum number of PCI Express lanes
    • 20
    PCI Express slots version
    • 5.0,4.0
    PCI Express configurations
    • 1x16+1x4,2x8+1x4
    Supported instruction sets
    • SSE4.1,SSE4.2,AVX 2.0
    Scalability
    • 1S
    CPU configuration (max)
    • 1
    Embedded options available
    • No
    Direct Media Interface (DMI) Revision
    • 4.0
    Export Control Classification Number (ECCN)
    • 5A992C
    Commodity Classification Automated Tracking System (CCATS)
    • 740.17B1
    Processor special features
    Intel® Hyper Threading Technology (Intel® HT Technology)
    • Yes
    Intel® Turbo Boost Technology
    • 2.0
    Intel® Quick Sync Video Technology
    • Yes
    Intel® Clear Video HD Technology (Intel® CVT HD)
    • Yes
    Intel® AES New Instructions (Intel® AES-NI)
    • Yes
    Enhanced Intel SpeedStep Technology
    • Yes
    Intel Trusted Execution Technology
    • Yes
    Intel® Speed Shift Technology
    • Yes
    Intel® Thermal Velocity Boost
    • Yes
    Intel® Adaptive Boost Technology
    • Yes
    Intel® Turbo Boost Max Technology 3.0 frequency
    • 5.8
    Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0
    • Yes
    Intel® Thermal Velocity Boost Frequency
    • 6
    Intel® Control-flow Enforcement Technology (CET)
    • Yes
    Intel® Thread Director
    • Yes
    Intel VT-x with Extended Page Tables (EPT)
    • Yes
    Intel® Secure Key
    • Yes
    Intel® Active Management Technology (Intel® AMT)
    • Yes
    Intel Stable Image Platform Program (SIPP)
    • Yes
    Intel® OS Guard
    • Yes
    Intel 64
    • Yes
    Intel Virtualization Technology (VT-x)
    • Yes
    Intel Virtualization Technology for Directed I/O (VT-d)
    • Yes
    Intel Turbo Boost Max Technology 3.0
    • Yes
    Intel® Boot Guard
    • Yes
    Intel® Deep Learning Boost (Intel® DL Boost)
    • Yes
    Intel® Volume Management Device (VMD)
    • Yes
    Mode-based Execute Control (MBE)
    • Yes
    Intel® vPro™ Platform Eligibility
    • Yes
    Intel® Standard Manageability (ISM)
    • Yes
    Intel® One-Click Recovery
    • Yes
    Intel® Stable IT Platform Program (SIPP)
    • Yes
    Intel® Remote Platform Erase (RPE)
    • Yes
    Intel® Virtualization Technology with Redirect Protection (VT-rp)
    • Yes
    Intel vPro® Enterprise Platform Eligibility
    • Yes
    Intel® Threat Detection Technology (TDT)
    • Yes
    Intel® Hardware Shield Eligibility
    • Yes
    Intel® Total Memory Encryption - Multi Key
    • Yes
    Intel vPro® Essentials Platform Eligibility
    • Yes
    Operational conditions
    Tjunction
    • 100
    Technical details
    Target market
    • Gaming, Content Creation
    OpenCL version
    • 3.0
    Launch date
    • Q1'23
    Status
    • Launched
    Logistics data
    Harmonized System (HS) code
    • 8542310001
    Packaging data
    Package type
    • Retail box
    Other features
    L2 cache
    • 32768
    Maximum internal memory
    • 192
    Graphics output
    • eDP 1.4b, DP 1.4a, HDMI 2.1