Skylake-EP (LGA3647)SKT-P up to 165W TDP+C621,8x DDR4 2

• 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP
• Intel® C621 Chipset
• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
• Expansion slots:2 PCIe 3.0 x8 (in x16),4 PCIe 3.0 x8,1 PCIe 3.0 x4 (in x8)
• M.2 NGFF connectorM.2 Interface:PCIe 3.0 x4 and SATAForm Factor: 2280, 22110Key: M-Key
• 2 GbE LAN ports
• 8 SATA3 (6Gbps) ports
• I/O: 1 VGA, 2 COM, TPM header
• 2 SuperDOM with built-in power
• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

• High-performance computing
• Data center servers
• Enterprise applications
• Virtualization

The Supermicro MBD-X11SPL-F-O is a highly versatile and robust motherboard designed for high-performance computing. It supports both 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors in a single socket LGA-3647 (Socket P), with CPU TDP support up to 165W.

This motherboard is equipped with the Intel C621 chipset, offering extensive connectivity and performance enhancements. With support for up to 2TB of 3DS ECC RDIMM or LRDIMM DDR4-2933MHz memory, and up to 1TB of Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only), it provides ample memory capacity for demanding applications.

The MBD-X11SPL-F-O features a range of expansion options including 2 PCIe 3.0 x8 (in x16), 4 PCIe 3.0 x8, and 1 PCIe 3.0 x4 (in x8), along with an M.2 NGFF connector supporting PCIe 3.0 x4 and SATA interfaces.

Its extensive I/O options include 2 GbE LAN ports, 1 VGA, 2 COM, 8 SATA3 (6Gbps) ports, and multiple USB ports. Additionally, the motherboard supports advanced management features such as IPMI 2.0, SuperDoctor 5, and Intel Node Manager for efficient system monitoring and control.