Intel Xeon SPR-SP CPU up to 56 cores 350W TDP+EBGPCH,8xD

• 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
• Intel C741® Chipset
• Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
• 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors
• 1 PCIe 5.0 x8,2 PCIe 5.0 x16,4 PCIe 5.0 x8 MCIO connectorsM.2 Interface:2 PCIe 4.0 x2M.2 Form Factor:2280, 22110M.2 Key:M-Key
• Dual LAN with 1GbE with Intel® I350
• 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
• Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10

• High-performance computing
• Data centers
• Enterprise applications
• Server environments
• Large-scale databases

The Supermicro MBD-X13SEM-F-O is designed with the latest technology to support next-generation Intel® Xeon® Scalable processors. With its single Socket LGA-4677, this motherboard can handle up to 350W TDP, ensuring powerful processing capabilities. It features 8 DIMM slots supporting up to 2TB of 3DS ECC RDIMM DDR5 memory, with speeds up to 5600MT/s. The motherboard also includes 8 NVMe ports via 4 MCIO connectors, dual LAN with Intel® I350, and a variety of expansion slots including PCIe 5.0 x16 and x8. Extensive I/O options are available including USB 3.2 Gen1, USB 2.0, and 10 SATA3 ports with RAID support. The MBD-X13SEM-F-O is ideal for high-performance computing, data centers, and enterprise applications.