[NR]X14 2U 300mm depth Rackmount, X14SBM-TP4F, 10G SFP+,CSE-

[NR]X14 2U 300mm depth Rackmount, X14SBM-TP4F, 10G SFP+,CSE-

SKU:	SYS-212B-FN4TP
Brand:	Supermicro
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Beskrivelsesammendrag

The Supermicro SuperServer SYS-212B-FN4TP is built for AI, 5G, and cloud computing applications, supporting advanced Intel Xeon processors and high-speed memory with ample expansion options and robust network connectivity.

Nøkkelfunksjoner

Design with compliance to NEBS-Level 3
Single Intel® Xeon® 6700E series processors with E-cores
8 DIMM slots supporting up to 1TB of memory
Up to 4 PCIe 5.0 x16 (3 FHHL + 1 HHHL) &1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
Onboard 2x 10GbE, 2X 10G SFP+
Optional 2 front hot-swap 2.5" NVMe drive bays

Viktige bruksområder

5G Core and Edge
AI Inference and Machine Learning
Network Function Virtualization
Cloud Computing

Beskrivelse

The Supermicro SuperServer SYS-212B-FN4TP offers compliance with NEBS-Level 3, supports single Intel Xeon 6700E series processors with E-cores, and includes 8 DIMM slots for up to 1TB of memory. It features up to 4 PCIe 5.0 x16 and 1 PCIe 5.0 x8 FHHL expansion slots for additional add-on cards. Connectivity options include onboard 2x 10GbE and 2x 10G SFP+ ports. Optional configurations include 2 front hot-swap 2.5" NVMe drive bays.

Produktspesifikasjoner

Specification	Details
Product SKUs
SKUs	SuperServer SYS-212B-FN4TP
Motherboard
Installed Motherboard	Super X14SBM-TP4F
Processor
CPU	Single Socket E2 (LGA-4710) Intel® Xeon® 6700 series processors with E-cores
Core Count	Up to 144C/144T; Up to 108MB Cache
Note	Supports up to 330W TDP CPUs (Air Cooled)* *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
GPU
Max GPU Count	Up to 3 single-width GPUs
CPU-GPU Interconnect	PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect	PCIe
System Memory
Memory	Slot Count: 8 DIMM slots Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
On-Board Devices
NVMe	NVMe; RAID 0/1 support(Intel® VROC RAID key required)
Chipset	System on Chip
Network Connectivity	2 RJ45 10GBASE-T with Intel® X710-TM4 2 SFP+ 10GbE with Intel® X710-TM4
Input / Output
LAN	1 RJ45 1 GbE Dedicated BMC LAN port 2 SFP+ 10 GbE LAN ports 2 RJ45 10 GbE LAN ports (Intel® X550-AT2)
USB	2 USB 3.2 Gen1 Type-A ports(front)
Video	1 VGA port
System BIOS
BIOS Type	AMI 256MB SPI Flash
Management
Software	SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations	ACPI Power Management Power-on mode for DC power recovery
Security
Hardware	Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features	Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
PC Health Monitoring
CPU	Monitors for CPU Cores, Chipset Voltages, Memory
FAN	Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature	Monitoring for CPU and chassis environment CPU thermal trip support, PEPI
Chassis
Form Factor	2U Rackmount
Model	CSE-211M-R000NDP
Dimensions and Weight
Height	3.5" (88.9 mm)
Width	17.2" (436.88 mm)
Depth	11.8" (298.8 mm)
Package	7.4" (H) x 19.3" (W) x 23.3" (D)
Weight	Gross Weight: 22 lbs (10 kg) Net Weight: 17 lbs (7.7 kg)
Available Color	Silver/Black
Expansion Slots
PCI-Express (PCIe) Configuration	*Default: 2 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x16 HHHL slot 1 PCIe 5.0 x8 HHHL slot Option A:* 3 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x8 FHHL slot 1 PCIe 5.0 x8 HHHL slot *Option B:** 3 PCIe 5.0 x16 FHHL slots 1 PCIe 5.0 x8 FHHL slot 1 PCIe 5.0 x16 HHHL slot (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
M.2	2 M.2 PCIe 5.0 x2 NVMe slots (M-key)
Drive Bays / Storage
Drive Bays Configuration	Default: Total 2 bays: 2 front hot-swap 2.5" PCIe 5.0 NVMe* drive bays (*NVMe support may require additional storage controller and/or cables)
M.2	2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110)
System Cooling
Fans	4x 4-PIN PWM 8cm Fan(s)
Power Supply
2x 800W Redundant (1 + 1) power supplies	Dimension (WxHxL): 54.5 x 40 x 220 mm
2x 600W Redundant (1 + 1) Typical 90%+ Level (96%) power supplies	Dimension (WxHxL): 54.5 x 40 x 220 mm AC Input: 600W: -44--65Vdc / 50-60Hz +12V: Max: 50A / Min: 0A Max: 50A 5V SB: Max: 3A / Min: 0A Output Type: Backplanes (gold finger)
2x 800W Redundant (1 + 1) Titanium Level (96%) power supplies	Dimension (WxHxL): 54.5 x 40.25 x 220 mm AC Input: 800W: 100-127Vac / 50-60Hz 860W: 200-240Vdc / 50-60Hz 860W: 200-240Vac / 50-60Hz +12V: Max: 66.67A / Min: 0A (100Vac-127Vac) Max: 71.67A / Min: 0A (200Vdc-240Vdc) Max: 71.67A / Min: 0A (200Vac-240Vac) 5V SB: Max: 4A / Min: 0A Output Type: Backplanes (gold finger)
Operating Environment
Environmental Spec.	Operating Temperature: 0°C ~ 45°C (32°F ~ 113°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)