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SKL Dual Processor E-ATX Workstation MB with BMC-SINGLE

MBD-X11DAI-N-O
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    Summary Description

    Featuring 2nd Gen Intel® Xeon® Scalable Processors support and powerful networking options, the Supermicro MBD-X11DAI-N-O is ideal for demanding applications.

    Key Features

    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable ProcessorsDual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
    • Intel® C621
    • Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    • 4 PCIe 3.0 x16,2 PCIe 3.0 x8,2 PCIe 3.0 NVMe x4 Internal Port(s)M.2 Interface:PCIe 3.0 x4M.2 Form Factor:2260, 2280, 22110M.2 Key:M-Key
    • Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • Dual LAN with GbE from C621
    • 1 VGA port

    Key Applications

    • High-performance computing
    • Data centers
    • Enterprise servers
    • Virtualization
    • Cloud computing
    • AI and ML workloads
    • Database management

    Description

    The Supermicro MBD-X11DAI-N-O motherboard supports 2nd Gen Intel® Xeon® Scalable Processors and includes dual sockets, up to 4TB 3DS ECC RDIMM, and various expansion slots like PCIe 3.0 x16 and NVMe. It comes equipped with advanced voltage monitoring, multiple fan headers for efficient cooling, and a robust IPMI for management. Other features include dual LAN with GbE, VGA port, and multiple USB ports, making it a versatile solution for intense computational tasks and heavy workloads.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X11DAi-No
    Physical Stats
    Form Factor
    • E-ATX
    Dimension
    • 12" x 13" (30.48cm x 33.02cm)
    Processor
    CPU
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
    • Dual Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
    System Memory
    Memory Capacity
    • 16 DIMM slots
    • Up to 4TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 4TB 3DS ECC RDIMM, DDR4-2933MT/s
    • Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    Memory Type
    • 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
    DIMM Sizes
    • LRDIMM: 64GB, 128GB
    • RDIMM: 64GB, 128GB
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    • Detects double-bit errors (using ECC memory)
    On-Board Devices
    Chipset
    • Intel® C621
    SATA
    • Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMI
    • ASPEED AST2500
    Audio
    • 7.1 HD Audio
    Graphics
    • 1 ASPEED AST2500 BMC port(s)
    Network Controllers
    • Dual LAN with GbE from C621
    Input / Output
    USB
    • 7 USB 3.2 Gen1 port(s) (2 via header; 4 rear; 1 type A)
    • 4 USB 3.2 Gen2 port(s) (1 rear type C; 2 rear; 1 rear type A)
    Video Output
    • 1 VGA port(s)
    Serial Port
    • 1 COM Port(s) (1 header)
    DOM
    • 2 SuperDOM(Disk on Module) ports
    TPM
    • 1 TPM Header
    Expansion Slots
    PCIe
    • 4 PCIe 3.0 x16,
    • 2 PCIe 3.0 x8
    M.2
    • M.2 Interface: PCIe 3.0 x4
    • Form Factor: 22110, 2280, 2260
    • Key: M-Key
    System BIOS
    BIOS Type
    • 32MB AMI SPI Flash ROM
    Management
    Software
    • SuperDoctor® 5, NMI,SUM,SPM, Intel® Node Manager,SSM,IPMI2.0, Watchdog
    PC Health Monitoring
    Voltage
    • Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V, Memory Voltages
    LED
    • Power LED
    • BMC/IPMI Heartbeat LED
    • Suspend static indicator LED
    • CPU / System Overheat LED
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU thermal trip support
    FAN
    • 7x 4-pin fan headers (up to 7 fans)
    • PWM fan speed control
    • Status monitoring for speed control
    • 7 fans with tachometer status monitoring
    Other Features
    • RoHS
    • Node Manager Support
    • CPU thermal trip support for processor protection
    • Chassis intrusion detection
    Operating Environment
    Operating Temperature Range
    • 10°C - 35°C (50°F - 95°F)
    Non-Operating Temperature Range
    • -40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range
    • 8% - 90% (non-condensing)
    Non Operating Relative Humidity Range
    • 5% - 95% (non-condensing)

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    I/O Shield
    MCP-260-00115-0N1STD size I/O Shield for X11DAi-N with EMI Gasket and front metal,RoHS/REACH
    IO Cable
    CBL-0044L2SATA CABLE 61CM FLAT S-S PBF
    X11DAi-N
    MBD-X11DAi-N1Motherboard
    Retail Package
    IO Cable
    CBL-0044L2STD size I/O Shield for X11DAi-N with EMI Gasket and front metal,RoHS/REACH
    IO shield
    MCP-260-00115-0N1Quick Reference Guide
    Quick Reference Guide
    MNL-1957-QRG1-
    X11DAi-N
    MBD-X11DAi-N1SATA CABLE 61CM FLAT S-S PBF

    Optional Part List

    Part Number Quantity Description
    TPM security module (optional, not included)
    AOM-TPM-9670V-SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9670H-SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
    AOM-TPM-9671V-SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9671H-SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor