Dual Processor Skylake DCO W/ WIO Riser Capability-BULK

MBD-X11DDW-NT-B
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    Summary Description

    Supermicro X11DDW-NT features support for 2nd Gen Intel® Xeon® Scalable Processors, up to 3TB ECC DDR4 memory across 12 DIMM slots, and extensive I/O and expansion capabilities. It is ideal for compute-intensive applications requiring high performance and reliable memory solutions.

    Key Features

    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
    • Intel® C622
    • Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    • 1 PCIe 3.0 x32 Left Riser Slot,1 PCIe 3.0 x16 Right Riser Slot,1 PCIe 3.0 x16 for Add-On-Module (AOM)M.2 Interface:PCIe 3.0 x4M.2 Form Factor:2242, 2260, 2280, 22110M.2 Key:M-KeyU.2 Interface: PCIe 3.0 x4,4 PCIe 3.0 NVMe x4 Internal Port(s)
    • Intel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • Dual LAN with 10Gbase-Tfrom C622
    • 1 VGA port

    Description

    The Supermicro X11DDW-NT motherboard is designed for high-performance, compute-intensive applications. It supports 2nd Gen Intel® Xeon® Scalable Processors, providing advanced processing power and efficiency. With 12 DIMM slots supporting up to 3TB of DDR4 memory and compatibility with Intel® Optane™ DC Persistent Memory, it offers robust memory solutions. The board includes multiple PCIe slots for expansive connectivity options, dual LAN with 10Gbase-T, and an array of SATA ports for versatile storage configurations. Additionally, onboard management features and health monitoring systems ensure optimal performance and reliability.

    Product Specifications

    Product SKUs
    MBD-X11DDW-NT
    Physical Stats
    Form FactorProprietary WIO
    Dimension12.3" x 13.4" (31.24cm x 34.04cm)
    Processor
    CPU2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
    Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
    NoteBIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
    System Memory
    Memory Capacity12 DIMM slots
    Up to 3TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 3TB 3DS ECC RDIMM, DDR4-2933MT/s
    Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
    Memory Type2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
    DIMM SizesLRDIMM: 64GB, 128GB
    RDIMM: 64GB, 128GB
    Memory Voltage1.2V
    Error DetectionCorrects single-bit errors
    Detects double-bit errors (using ECC memory)
    On-Board Devices
    ChipsetIntel® C622
    SATAIntel® C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMIASPEED AST2500
    Graphics1 ASPEED AST2500 BMC port(s)
    Network ControllersDual LAN with 10Gbase-T, from C622
    Input / Output
    LAN2 RJ45 10GBase-T ports
    USB6 USB 3.2 Gen1 port(s) (2 via header; 4 rear)
    Video Output1 VGA port(s)
    DOM2 SuperDOM(Disk on Module) ports
    TPM1 TPM Header
    Expansion Slots
    PCIe1 PCIe 3.0 x32 Left Riser Slot,
    1 PCIe 3.0 x16 Right Riser Slot,
    1 PCIe 3.0 x16 for Add-On-Module (AOM)
    M.2M.2 Interface: PCIe 3.0 x4
    Form Factor: 22110, 2280, 2242, 2260
    Key: M-Key
    System BIOS
    BIOS Type256MB UEFI
    Management
    SoftwareSuperDoctor® 5,SUM, KVM with dedicated LAN,SPM, Intel® Node Manager,SSM,IPMI2.0, Watchdog
    PC Health Monitoring
    VoltageMonitors CPU voltages, +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
    LEDUID/Remote UID
    Power LED
    BMC/IPMI Heartbeat LED
    CPU / System Overheat LED
    TemperatureMonitoring for CPU and chassis environment
    CPU thermal trip support
    FAN6x 4-pin fan headers (up to 6 fans)
    PWM fan speed control
    6 fans with tachometer status monitoring
    Status monitoring for speed control
    Other FeaturesUID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection
    Operating Environment
    Operating Temperature Range10°C - 35°C (50°F - 95°F)
    Non-Operating Temperature Range-40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range8% - 90% (non-condensing)
    Non Operating Relative Humidity Range5% - 95% (non-condensing)

    Standard Part List

    Bulk Package
    IO Cable
    Part NumberQuantityDescription
    CBL-SAST-0388L-021IPASS to 4 SATA cable
    X11DDW-NT
    Part NumberQuantityDescription
    MBD-X11DDW-NT1Motherboard
    Retail Package
    IO Cable
    Part NumberQuantityDescription
    CBL-SAST-0388L-021IPASS to 4 SATA cable
    Quick Reference Guide
    Part NumberQuantityDescription
    MNL-1907-QRG1Quick Reference Guide
    X11DDW-NT
    Part NumberQuantityDescription
    MBD-X11DDW-NT1Motherboard

    Optional Part List

    TPM security module (optional, not included)
    Part NumberQuantityDescription
    AOM-TPM-9670V-S-SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
    AOM-TPM-9671V-S-SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor