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Skylake-EP(LGA3647) SKT-Pupto 205W TDP+C622,8xDDR4-SINGL

MBD-X11SPH-NCTF-O
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    Summary Description

    The Supermicro MBD-X11SPH-NCTF-O motherboard supports 2nd Gen Intel® Xeon® Scalable Processors, single socket LGA-3647, and up to 2TB ECC RDIMM or LRDIMM DDR4-2933MHz memory.

    Key Features

    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP
    • Intel® C622 chipset
    • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
    • Expansion slots:1 PCIe 3.0 x16 (x16 || x8),1 PCIe 3.0 x8 (x0 || x8),1 PCIe 3.0 x8,1 PCIe 3.0 x4 (in x8)
    • 2x Port NVMe PCIe 3.0 x4 via OCuLink
    • M.2 NGFF connectorM.2 Interface:PCIe 3.0 x4 and SATAForm Factor: 2280Key: M-Key
    • 8 SAS3 (12Gbps) via Broadcom® 3008; RAID 0, 1, 10
    • 2 10GbE LAN ports
    • 10 SATA3 (6Gbps) via C622
    • 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)

    Key Applications

    • Enterprise servers
    • High-performance computing
    • Data centers
    • Cloud computing
    • Virtualization

    Description

    The Supermicro MBD-X11SPH-NCTF-O motherboard is designed for high-performance computing, supporting 2nd Gen Intel® Xeon® Scalable Processors with a single LGA-3647 socket and up to 2TB of memory in its 8 DIMM slots. It features Intel® C622 chipset, PCIe 3.0 expansion slots, NVMe, SATA, SAS, USB connectivity, and dual 10GbE LAN ports. Ideal for enterprise applications and server environments, it offers advanced management and monitoring capabilities with SuperDoctor® 5, IPMI 2.0, and TPM security modules, ensuring reliability and security.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X11SPH-nCTF
    Physical Stats
    Form Factor
    • ATX
    Dimension
    • 12" x 9.6" (30.48cm x 24.38cm)
    Processor
    CPU
    • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
    • Single Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP
    Core
    • Up to 28 cores
    Note
    • BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SPBIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
    System Memory
    Memory Capacity
    • 8 DIMM slots
    • Up to 2TB 3DS ECC LRDIMM, DDR4-2933MT/s; Up to 2TB 3DS ECC RDIMM, DDR4-2933MT/s
    Memory Type
    • 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
    DIMM Sizes
    • LRDIMM: 32GB, 64GB, 128GB
    • RDIMM: 8GB, 16GB, 32GB, 64GB
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    On-Board Devices
    Chipset
    • Intel® C622
    SATA
    • Broadcom® 3008 SW controller for 8 SAS3 (12 Gbps) ports; RAID 0,1,10
    • Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMI
    • ASPEED AST2500
    Graphics
    • 1 ASPEED AST2500 BMC port(s)
    Network Controllers
    • Dual LAN with 10GBase-T with Intel® X722 + X557
    Input / Output
    SATA
    • 10 SATA3 (6Gbps) port(s)
    SAS
    • 8 SAS port(s)
    LAN
    • 2 RJ45 10GBase-T ports
    USB
    • 8 USB 2.0 port(s) (2 rear; 6 via header)
    • 2 USB 3.0 port(s) (2 rear)
    • 3 USB 3 port(s) (2 via header; 1 type A)
    Video Output
    • 1 VGA port(s)
    Serial Port
    • 2 COM Port(s) (1 header; 1 rear)
    DOM
    • 2 SATADOM(Disk on Module) power connector support
    TPM
    • 1 TPM Header
    Expansion Slots
    PCIe
    • 1 PCIe 3.0 x16 (x16 or x8 ),
    • 1 PCIe 3.0 x8 (x0 or x8 ),
    • 1 PCIe 3.0 x8,
    • 1 PCIe 3.0 x4 (in x8 slot)
    M.2
    • M.2 Interface: PCIe 3.0 x4; SATA
    • Form Factor: 2280
    • Key: M-Key
    System BIOS
    BIOS Type
    • AMI UEFI
    BIOS Features
    • ACPI 6.0
    • RTC (Real Time Clock) Wakeup
    • SMBIOS 3.0 or later
    Management
    Software
    • SuperDoctor® 5, NMI,SUM, KVM with dedicated LAN,SPM, Intel® Node Manager,IPMI2.0, Watchdog
    Power Configurations
    • Power-on mode for AC power recovery, ACPI Power Management
    PC Health Monitoring
    Voltage
    • VBAT, Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, +1.8V, 8 -fan status
    LED
    • UID/Remote UID
    • Suspend static indicator LED
    • CPU / System Overheat LED
    Temperature
    • CPU thermal trip support
    • PECI
    FAN
    • 8x 4-pin fan headers (up to 8 fans)
    • System level control
    • PWM fan speed control
    • Fan speed control
    • Overheat LED indication
    Other Features
    • WOL
    • UID
    • RoHS
    • Control of power-on for recovery from AC power loss
    • ACPI power management
    Operating Environment
    Operating Temperature Range
    • 0°C - 50°C (32°F - 122°F)
    Non-Operating Temperature Range
    • -40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range
    • 8% - 90% (non-condensing)
    Non Operating Relative Humidity Range
    • 5% - 95% (non-condensing)

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    I/O Cables
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    I/O Shield
    MCP-260-00109-0N1STD I/O Shield for X11SPH-nCTF with EMI Gasket
    Retail Package
    I/O Cables
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    I/O Shield
    MCP-260-00109-0N1STD I/O Shield for X11SPH-nCTF with EMI Gasket
    QRG
    MNL-1949-QRG1Motherboard Quick Reference Guide

    Optional Part List

    Part Number Quantity Description
    1U I/O Shield
    MCP-260-00114-0N11U I/O Shield for X11SPH-nCTF with EMI Gasket
    TPM security module
    AOM-TPM-9670V1SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9671V1SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9670H1SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
    AOM-TPM-9671H1SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor