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X12 Mainstream DP MB with AST2600 (10G LAN),RoHS

MBD-X12DPI-NT6-B
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    Summary Description

    The Supermicro MBD-X12DPI-NT6-B is a robust motherboard designed to support 3rd Gen Intel® Xeon® Scalable processors. It offers immense processing power with dual sockets, expansive memory support, and advanced networking capabilities.

    Key Features

    • 3rd Gen Intel® Xeon® Scalable processorsDual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
    • Intel® C621A
    • Up to 4TB RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHzUp to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only.
    • 2 PCIe 4.0 x8,4 PCIe 4.0 x16,2 PCIe 4.0 NVMe x8 Internal Port(s)M.2 Interface:1 PCIe 4.0 x4M.2 Form Factor:2280/22110M.2 Key:M-Key
    • Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • Dual LAN with 10GBase-T with Intel® X550
    • 2 VGA (1 rear bezel, 1 front panel) ports

    Key Applications

    • High-performance computing
    • Data-intensive applications
    • Enterprise server solutions
    • Cloud computing
    • Virtualization

    Description

    The Supermicro MBD-X12DPI-NT6-B motherboard features dual Socket P+ (LGA-4189) that supports 3rd Gen Intel® Xeon® Scalable processors with up to 270W TDP and 40 cores. It includes 18 DIMM slots supporting up to 4TB of DDR4 memory, including Intel® Optane™ Persistent Memory 200 Series. The board is equipped with 14 SATA3 ports, dual 10GBase-T LAN ports with Intel® X550, and various expansion options including PCIe 4.0 and M.2 slots. Ideal for high-performance computing and data-intensive applications.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X12DPi-NT6
    Physical Stats
    Form Factor
    • E-ATX
    Dimension
    • 12" x 13" (30.48cm x 33.02cm)
    Processor
    CPU
    • 3rd Gen Intel® Xeon® Scalable processors
    • Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
    Core
    • Up to 40 cores
    System Memory
    Memory Capacity
    • 18 DIMM slots
    • Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s
    • Up to 4TB 3DS ECC LRDIMM, DDR4-3200MT/s; Up to 4TB ECC RDIMM, DDR4-3200MT/s
    • P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
    Memory Type
    • 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM
    DIMM Sizes
    • LRDIMM: 256GB
    • RDIMM: 256GB
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    • Detects double-bit errors (using ECC memory)
    On-Board Devices
    Chipset
    • Intel® C621A
    SATA
    • Intel® C621A controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMI
    • ASPEED AST2600 BMC
    Network Controllers
    • Dual LAN with 10GBase-T with Intel® X550
    Input / Output
    SATA
    • 14 SATA3 (6Gbps) port(s)
    LAN
    • 2 RJ45 10 Gigabit Ethernet LAN ports
    USB
    • 2 USB 2.0 port(s) (2 via header)
    • 7 USB 3.2 Gen1 port(s) (2 via header; 4 rear; 1 type A)
    Video Output
    • 2 VGA (1 rear bezel, 1 front panel) port(s)
    Serial Port
    • 2 COM Port(s) (1 header; 1 rear)
    TPM
    • 1 TPM Header
    Expansion Slots
    PCIe
    • 4 PCIe 4.0 x16,
    • 2 PCIe 4.0 x8
    M.2
    • M.2 Interface: 1 PCIe 4.0 x4
    • Form Factor: 2280/22110
    • Key: M-Key
    System BIOS
    BIOS Type
    • AMI UEFI
    Management
    Software
    • Redfish API,Supermicro Server Manager (SSM),Supermicro Power Manager (SPM),Supermicro Update Manager (SUM),Supermicro SuperDoctor® 5 (SD5),Super Diagnostics Offline (SDO),KVM with dedicated LAN,IPMI 2.0
    System Management Software
    • IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
    Security
    Hardware
    • Trusted Platform Module (TPM) 2.0
    PC Health Monitoring
    Voltage
    • VBAT, System temperature, PCH temperature, Monitors CPU voltages, Memory temperature, CPU temperature, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, VRM temperature, Memory Voltages, LAN temperature, 8 -fan status
    LED
    • UID/Remote UID
    • Power LED
    • BMC/IPMI Heartbeat LED
    FAN
    • 8x 4-pin fan headers (up to 8 fans)
    • PWM fan speed control
    Other Features
    • WOL, UID, RoHS, Node Manager Support, Dual Cooling Zones, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, ATX Power connector, ACPI power management, SDDC, RoT, NCSI header
    Operating Environment
    Operating Temperature Range
    • 10°C - 35°C (50°F - 95°F)
    Non-Operating Temperature Range
    • -40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range
    • 8% - 90% (non-condensing)
    Non Operating Relative Humidity Range
    • 5% - 95% (non-condensing)

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    CPU carrier
    SKT-1205L-P4IC-FXC2CPU carrier for 3rd Gen Intel Xeon Scalable Processors
    I/O Cables
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    I/O Shield
    MCP-260-00042-0N1STD I/O SHIELD
    Retail Package
    CPU carrier
    SKT-1205L-P4IC-FXC2CPU carrier for 3rd Gen Intel Xeon Scalable Processors
    I/O Shield
    MCP-260-00042-0N1STD I/O SHIELD
    Quick Reference Guide
    MNL-2233-QRG1X12DPi-N(T)6 Quick Reference Guide

    Optional Part List

    Part Number Quantity Description
    TPM security module (optional, not included)
    AOM-TPM-9670H1SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
    AOM-TPM-9670V1SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9671V1SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9671H1SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor