X12SPL-F,ATX,LGA-4189 SKT-P+,Intel C621A,8x DDR4 3200MHz

MBD-X12SPL-F-O
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    Summary Description

    Supermicro MBD-X12SPL-F-O. Processor manufacturer: Intel, Processor socket: LGA 3647 (Socket P), Compatible processor series: Intel® Xeon®. Supported memory types: DDR4-SDRAM, Maximum internal memory: 2 TB, Memory slots type: DIMM. Supported storage drive interfaces: M.2, SATA III, Supported storage drive types: HDD & SSD. Graphics card family: ASPEED. Ethernet interface type: Gigabit Ethernet, LAN controller: Intel I210

    Key Features

    • 3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
    • Intel® C621A
    • Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHzUp to 2TB Intel® Optane™ Persistent Memory, in 8 DIMM slots
    • 2 PCIe 4.0 x8,1 PCIe 4.0 x16,1 PCIe 4.0 x8 (in x16 slot)3 PCIe 3.0 x8M.2 Interface:1 SATA/PCIe 3.0 x4M.2 Form Factor:2280/22110M.2 Key:M-Key
    • Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • Dual LAN with Intel® i210 Gigabit Ethernet Controller

    Key Applications

    • Data centers
    • Enterprise servers
    • High-performance computing
    • Database management
    • Virtualization
    • Networking applications

    Description

    The Supermicro MBD-X12SPL-F-O is a high-performance ATX motherboard designed to support 3rd Gen Intel® Xeon® Scalable processors. It features a single socket Socket P+ (LGA-4189) and supports up to 270W TDP. With up to 2TB of DDR4 ECC memory, the board offers 8 DIMM slots that can accommodate Intel® Optane™ Persistent Memory. The motherboard includes various expansion slots such as PCIe 4.0 and PCIe 3.0, and it supports numerous storage interfaces including M.2 and SATA3. The Intel® C621A chipset ensures robust performance and reliability, while the dual LAN with Intel® i210 Gigabit Ethernet controllers provide fast and stable network connectivity. Essential management features such as IPMI 2.0 and a host of Supermicro’s management software like Redfish API and SuperDoctor® 5 offer seamless monitoring and control. Security is robust with TPM 2.0 support, and the comprehensive health monitoring features ensure system longevity and stability. This motherboard is ideal for data centers, enterprise servers, and high-performance computing environments.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • MBD-X12SPL-F
    Physical Stats
    Form Factor
    • ATX
    Dimension
    • 12.1" x 10" (30.73cm x 25.4cm)
    Processor
    CPU
    • 3rd Gen Intel® Xeon® Scalable processors
    • Single Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP
    Core
    • Up to 40 cores
    System Memory
    Memory Capacity
    • 8 DIMM slots
    • Up to 2TB Intel® Optane™ Persistent Memory 200 Series
    • Up to 2TB 3DS ECC LRDIMM, DDR4-3200MT/s; Up to 2TB 3DS ECC RDIMM, DDR4-3200MT/s
    Memory Type
    • 3200/2933/2666 MT/s ECC , DDR4 LRDIMM (3DS), RDIMM (3DS)
    DIMM Sizes
    • 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
    Memory Voltage
    • 1.2V
    Error Detection
    • Corrects single-bit errors
    On-Board Devices
    Chipset
    • Intel® C621A
    SATA
    • Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    IPMI
    • ASPEED AST2600 BMC
    Graphics
    • 1 ASPEED AST2600 BMC port(s)
    Network Controllers
    • Dual LAN with Intel® i210 Gigabit Ethernet Controller
    Input / Output
    SATA
    • 10 SATA3 (6Gbps) port(s)
    LAN
    • 2 RJ45 Gigabit Ethernet LAN ports
    USB
    • 6 USB 2.0 port(s) (4 via header; 2 rear)
    • 5 USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A)
    Video Output
    • 1 VGA port(s)
    Serial Port
    • 1 COM Port(s) (1 header)
    DOM
    • 2 SATADOM(Disk on Module) power connector support
    TPM
    • 1 TPM Header
    Expansion Slots
    PCIe
    • 1 PCIe 4.0 x16,
    • 1 PCIe 4.0 x8 (in x16 slot),
    • 2 PCIe 4.0 x8,
    • 3 PCIe 3.0 x8
    M.2
    • M.2 Interface: 1 SATA/PCIe 3.0 x4
    • Form Factor: 2280/22110
    • Key: M-Key
    System BIOS
    BIOS Type
    • AMI UEFI
    BIOS Features
    • ACPI 6.2
    • SMBIOS 3.0 or later
    • UEFI 2.7
    Management
    Software
    • Redfish API,Supermicro Server Manager (SSM),Supermicro Power Manager (SPM),Supermicro Update Manager (SUM),Supermicro SuperDoctor® 5 (SD5),Super Diagnostics Offline (SDO),KVM with dedicated LAN,IPMI 2.0
    Power Configurations
    • Power-on mode for AC power recovery, ACPI Power Management, CPU thermal trip support for processor protection
    Security
    Hardware
    • Trusted Platform Module (TPM) 2.0
    PC Health Monitoring
    Voltage
    • VBAT, System temperature, Monitors CPU voltages, HT, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, +1.8V, 7-fan status
    LED
    • UID/Remote UID
    • Suspend static indicator LED
    • CPU / System Overheat LED
    Temperature
    • CPU thermal trip support
    • PECI
    FAN
    • 7x 4-pin fan headers (up to 7 fans)
    • System level control
    • PWM fan speed control
    • Fan speed control
    • Overheat LED indication
    Other Features
    • WOL, UID, RoHS, Chassis intrusion header, Chassis intrusion detection, ATX Power connector, ACPI power management, RoT
    Operating Environment
    Operating Temperature Range
    • 0°C - 50°C (32°F - 122°F)
    Non-Operating Temperature Range
    • -40°C - 70°C (-40°F - 158°F)
    Operating Relative Humidity Range
    • 10% - 85% (non-condensing)
    Non Operating Relative Humidity Range
    • 10% - 95% (non-condensing)

    Standard Part List

    Part Number Quantity Description
    Bulk Package
    CPU carrier
    SKT-1205L-P4IC-FXC1CPU carrier for 3rd Gen Intel Xeon Scalable Processors
    I/O Cables
    CBL-0044L257.5CM SATA FLAT S-S PBF
    I/O Shield
    MCP-260-00130-0N1STD I/O Shield for X12SPL-F with EMI Gasket
    Retail Package
    CPU carrier
    SKT-1205L-P4IC-FXC1CPU carrier for 3rd Gen Intel Xeon Scalable Processors
    I/O Cables
    CBL-0044L257.5 cm SATA FLAT S-S PBF
    I/O Shield
    MCP-260-00130-0N1STD I/O Shield for X12SPL-F with EMI Gasket
    QRG
    MNL-2270-QRG1Motherboard Quick Reference Guide

    Optional Part List

    Part Number Quantity Description
    1U I/O Shield
    MCP-260-00131-0N11U I/O Shield for X12SPL-F with EMI Gasket (for standard 1U chassis: SC813M, SC815, SC512, SC514, SC515, SC113)
    MCP-260-00132-0B11U I/O Shield for X12SPL-F with EMI Gasket (for standard 1U chassis: SC510, SC504, SC505)
    TPM security module
    AOM-TPM-9670V1SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9671V1SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
    AOM-TPM-9670H1SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
    AOM-TPM-9671H1SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor