Intel Xeon SPR-SP CPU up to 56 cores 350W TDP+EBGPCH,8xD

• 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
• Intel C741® Chipset
• Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
• 8 NVMe ports PCIe 5.0 x4 via 4 MCIO connectors
• 1 PCIe 5.0 x8,2 PCIe 5.0 x16,4 PCIe 5.0 x8 MCIO connectorsM.2 Interface:2 PCIe 4.0 x2M.2 Form Factor:2280, 22110M.2 Key:M-Key
• Dual LAN with 10GBase-T with Intel® X550
• 5 USB 3.2 Gen1 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
• Intel® C741 controller for 10 SATA3 (6 Gbps) ports or 2 PCIe 3.0 x4 NVMe + 2 SATA3 ports; RAID (SATA) 0,1,5,10

• Enterprise servers
• Data centers
• Workstations
• High-performance computing

The Supermicro MBD-X13SEM-TF-O is designed to deliver outstanding performance and flexibility for demanding computing environments. It supports 5th/4th Gen Intel Xeon Scalable processors in a single LGA-4677 (Socket E) socket, with CPU TDP support up to 350W. The Intel C741 chipset offers a wealth of connectivity options, including 8 NVMe ports, multiple PCIe 5.0 and 4.0 slots, and comprehensive I/O features. The board supports up to 2TB of ECC 3DS RDIMM DDR5 memory across 8 DIMM slots, with speeds up to 5600MT/s. Dual LAN with 10GBase-T, a variety of USB ports, integrated BMC for IPMI, and robust security features like TPM 2.0 make this motherboard ideal for enterprise and data center use.