Summary Description
The Supermicro 1U Passive CPU Heat Sink with socket LGA3647-0 is specifically designed for X11 generation general 1U servers equipped with Intel® Xeon® Scalable Processors. This heat sink has been rigorously tested and validated by Supermicro to guarantee optimal quality and cooling efficiency. It is certified for Supermicro servers and supports a thermal design power (TDP) up to 205 Watts, ensuring compliance with RoHS and REACH standards.
Key Features
- RoHS and REACH compliant
- Fully tested and validated by Supermicro
- Supermicro Certified
- 1U Passive CPU Heat Sink
- Socket LGA3647-0 Narrow Mounting Mechanism
- Intel® Xeon® Scalable Processors
- Compatible with Supermicro X11 generation 1U servers
- Supports TDP up to 205 Watts
Key Applications
- X11 Purley Platform 1U Series Servers
Description
This CPU heat sink is designed for Supermicro X11 generation general 1U servers equipped with Intel® Xeon® scalable processors. The heat sink has been fully tested and validated by Supermicro to ensure the best quality and cooling performance.
Product Specifications
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