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[NR]X14 2U 300mm depth Rackmount, X14SBM-TP4F, 10G SFP+,CSE-

SYS-212B-FN4TP

For this server, it's best to contact us for a fully validated, configured model. You can also add desired components to your cart, select "pay by bank transfer" at checkout, and we'll try to fulfill your wishes. We'll configure your system as closely as possible and send an updated quote with a validated system shortly. You can then decide if you want this configuration. The final payment method will be agreed upon after you accept the configuration.

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kr 21,707.03 21707.03 NOK kr 21,707.03

kr 21,707.03

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    Summary Description

    The Supermicro SuperServer SYS-212B-FN4TP is built for AI, 5G, and cloud computing applications, supporting advanced Intel Xeon processors and high-speed memory with ample expansion options and robust network connectivity.

    Key Features

    • Design with compliance to NEBS-Level 3
    • Single Intel® Xeon® 6700E series processors with E-cores
    • 8 DIMM slots supporting up to 1TB of memory
    • Up to 4 PCIe 5.0 x16 (3 FHHL + 1 HHHL) &1 PCIe 5.0 x8 FHHL expansion slots for Accelerator Add-On-Cards
    • Onboard 2x 10GbE, 2X 10G SFP+
    • Optional 2 front hot-swap 2.5" NVMe drive bays

    Key Applications

    • 5G Core and Edge
    • AI Inference and Machine Learning
    • Network Function Virtualization
    • Cloud Computing

    Description

    The Supermicro SuperServer SYS-212B-FN4TP offers compliance with NEBS-Level 3, supports single Intel Xeon 6700E series processors with E-cores, and includes 8 DIMM slots for up to 1TB of memory. It features up to 4 PCIe 5.0 x16 and 1 PCIe 5.0 x8 FHHL expansion slots for additional add-on cards. Connectivity options include onboard 2x 10GbE and 2x 10G SFP+ ports. Optional configurations include 2 front hot-swap 2.5" NVMe drive bays.

    Product Specifications

    Specification Details
    Product SKUs
    SKUs
    • SuperServer SYS-212B-FN4TP
    Motherboard
    Installed Motherboard
    • Super X14SBM-TP4F
    Processor
    CPU
    • Single Socket E2 (LGA-4710)
    • Intel® Xeon® 6700 series processors with E-cores
    Core Count
    • Up to 144C/144T; Up to 108MB Cache
    Note
    • Supports up to 330W TDP CPUs (Air Cooled)*
    • *Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.
    GPU
    Max GPU Count
    • Up to 3 single-width GPUs
    CPU-GPU Interconnect
    • PCIe 5.0 x16 CPU-to-GPU Interconnect
    GPU-GPU Interconnect
    • PCIe
    System Memory
    Memory
    • Slot Count: 8 DIMM slots
    • Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM
    On-Board Devices
    NVMe
    • NVMe; RAID 0/1 support(Intel® VROC RAID key required)
    Chipset
    • System on Chip
    Network Connectivity
    • 2 RJ45 10GBASE-T with Intel® X710-TM4
    • 2 SFP+ 10GbE with Intel® X710-TM4
    Input / Output
    LAN
    • 1 RJ45 1 GbE Dedicated BMC LAN port
    • 2 SFP+ 10 GbE LAN ports
    • 2 RJ45 10 GbE LAN ports (Intel® X550-AT2)
    USB
    • 2 USB 3.2 Gen1 Type-A ports(front)
    Video
    • 1 VGA port
    System BIOS
    BIOS Type
    • AMI 256MB SPI Flash
    Management
    Software
    • SuperCloud Composer
    • Supermicro Server Manager (SSM)
    • Super Diagnostics Offline (SDO)
    • Supermicro Thin-Agent Service (TAS)
    • SuperServer Automation Assistant (SAA) New!
    Power configurations
    • ACPI Power Management
    • Power-on mode for DC power recovery
    Security
    Hardware
    • Trusted Platform Module (TPM) 2.0
    • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
    Features
    • Cryptographically Signed Firmware
    • Secure Boot
    • Secure Firmware Updates
    • Automatic Firmware Recovery
    • Supply Chain Security: Remote Attestation
    • Runtime BMC Protections
    • System Lockdown
    PC Health Monitoring
    CPU
    • Monitors for CPU Cores, Chipset Voltages, Memory
    FAN
    • Fans with tachometer monitoring
    • Status monitor for speed control
    • Pulse Width Modulated (PWM) fan connectors
    Temperature
    • Monitoring for CPU and chassis environment
    • CPU thermal trip support, PEPI
    Chassis
    Form Factor
    • 2U Rackmount
    Model
    • CSE-211M-R000NDP
    Dimensions and Weight
    Height
    • 3.5" (88.9 mm)
    Width
    • 17.2" (436.88 mm)
    Depth
    • 11.8" (298.8 mm)
    Package
    • 7.4" (H) x 19.3" (W) x 23.3" (D)
    Weight
    • Gross Weight: 22 lbs (10 kg)
    • Net Weight: 17 lbs (7.7 kg)
    Available Color
    • Silver/Black
    Expansion Slots
    PCI-Express (PCIe) Configuration
    Default*:
    • 2 PCIe 5.0 x16 FHHL slots
    • 1 PCIe 5.0 x16 HHHL slot
    • 1 PCIe 5.0 x8 HHHL slot

    Option A*:
    • 3 PCIe 5.0 x16 FHHL slots
    • 1 PCIe 5.0 x8 FHHL slot
    • 1 PCIe 5.0 x8 HHHL slot

    Option B*:
    • 3 PCIe 5.0 x16 FHHL slots
    • 1 PCIe 5.0 x8 FHHL slot
    • 1 PCIe 5.0 x16 HHHL slot

    • (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
    M.2
    • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key)
    Drive Bays / Storage
    Drive Bays Configuration
    Default: Total 2 bays:
    • 2 front hot-swap 2.5" PCIe 5.0 NVMe* drive bays

    • (*NVMe support may require additional storage controller and/or cables)
    M.2
    • 2 M.2 PCIe 5.0 x2 NVMe slots (M-key 2280/22110)
    System Cooling
    Fans
    • 4x 4-PIN PWM 8cm Fan(s)
    Power Supply
    2x 800W Redundant (1 + 1) power supplies
    Dimension (WxHxL):
    • 54.5 x 40 x 220 mm

    2x 600W Redundant (1 + 1) Typical 90%+ Level (96%) power supplies
    Dimension (WxHxL):
    • 54.5 x 40 x 220 mm

    AC Input:
    • 600W: -44--65Vdc / 50-60Hz

    +12V:
    • Max: 50A / Min: 0A
    • Max: 50A

    5V SB:
    • Max: 3A / Min: 0A

    Output Type:
    • Backplanes (gold finger)

    2x 800W Redundant (1 + 1) Titanium Level (96%) power supplies
    Dimension (WxHxL):
    • 54.5 x 40.25 x 220 mm

    AC Input:
    • 800W: 100-127Vac / 50-60Hz
    • 860W: 200-240Vdc / 50-60Hz
    • 860W: 200-240Vac / 50-60Hz

    +12V:
    • Max: 66.67A / Min: 0A (100Vac-127Vac)
    • Max: 71.67A / Min: 0A (200Vdc-240Vdc)
    • Max: 71.67A / Min: 0A (200Vac-240Vac)

    5V SB:
    • Max: 4A / Min: 0A

    Output Type:
    • Backplanes (gold finger)

    Operating Environment
    Environmental Spec.
    • Operating Temperature: 0°C ~ 45°C (32°F ~ 113°F)
    • Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
    • Operating Relative Humidity: 8% to 90% (non-condensing)
    • Non-operating Relative Humidity: 5% to 95% (non-condensing)